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Thread: thermal paste vs. thermal tape

  1. #1
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    thermal paste vs. thermal tape

    whihc one is more effective a removing heat, thermal paste or thermal tape?

    and can u plz tell me whats hte advantages and when to use for each.

    thanks

  2. #2
    Hired Geek fishybawb's Avatar
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    Thermal paste is generally better. The only reason I'd use tape over it would be to stick the heatsink onto a chip if there was no other means of attaching it. Even then I'd probably use thermal adhesive, but at least with tape the heatsink can easily and safely be removed if needs be.

  3. #3
    Ultimate Member Magua's Avatar
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    Thermal Paste is generally better. The advantage to pads is that it would be pretty difficult to screw up.

  4. #4
    Ultimate Member G's Avatar
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    I would only use thermal paste unless there is a compelling reason to use a thermal pad for a particular mobo+HSF combination.

    The leader in thermal paste seems to be Artic Silver, and this is what I exclusively use.

    http://www.arcticsilver.com/

    Keep away from epoxy, as you do not need this.

    Go with AR V5 thermal paste.
    http://www.arcticsilver.com/as5.htm

    Follow their instructions and FAQ (under construction)
    http://www.arcticsilver.com/arctic_s...structions.htm
    http://www.arcticsilver.com/faq.htm

  5. #5
    Ultimate Member Magua's Avatar
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    Yep I also use arctic silver 5, their website has a pretty good tutorial for how to apply it.

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    Originally posted by fishybawb and Magua
    Thermal paste is generally better.
    Thermal paste is not generally better, it is simply way better than thermal pads or tape. Contact is much better, allowing for better heat conductivity, and the layer of paste (if applied correctly) between the surfaces of the processor and the heatsink is a lot thinner than a thermal pad, also allowing better heat conductivity.

    Thermal pads are used because they work somewhat and are easy and cheap to apply in manufacturing.

  7. #7
    Gone Fishin' ukulele's Avatar
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    You guys are all full of Bologna on this subject. You are reading to many geek rags. Thermal tape works great. In fact it is good enough to use more then once. Try that with thermal paste.

  8. #8
    Ultimate Member Rob R.'s Avatar
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    IMHO I don't think the gap between thermal paste and thermal tape is as big as it's made out to be in this thread. Granted, Thermal paste is slightly better, and that is about it.

  9. #9
    Ultimate Member SPEEDO's Avatar
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    Lapping the heatsink and thermal paste is the only way to go....

  10. #10
    Ultimate Member Billforce's Avatar
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    Be careful though, depending on your dealer, it could nullify your warrantee if you remove the tape and install paste. The Fan/heatsink supplied with AMD retail packages has thermal tape on the HS. Use it!
    "Never corner something that's meaner than you are"

  11. #11
    Ultimate Member G's Avatar
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    If you apply the paste correctly then thermal paste beats thermal pads hands down. I would not use a pad over paste unless there was a good reason to do so. I have not heard of a strong reason or come across a situation that makes this so.

    May be ukulele can explain further?

  12. #12
    Gone Fishin' ukulele's Avatar
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    Originally posted by G
    If you apply the paste correctly then thermal paste beats thermal pads hands down. I would not use a pad over paste unless there was a good reason to do so. I have not heard of a strong reason or come across a situation that makes this so.

    May be ukulele can explain further?
    What's to explain? After 30 years of working with computers you learn something. I have tried both in more ways then you can count. I have even used di-electric compound, white grease and once even tried tin foil and military orange grease. The thermal pads work just fine and last longer then anything else. I should know, I live in a nasty environment for computer parts. The manufacturers specify thermal pads because they have been tested to work the best over time. I choose them because they work as specified. Lapping a heatsink is a waste of time too. If you put a mirror finish on a surface it actually has less surface contact then a rougher finish. Why do you think heatsinks are finned and not solid blocks.

  13. #13
    Ultimate Member G's Avatar
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    I agree with your lapping argument, as it is easy to think this through.

    Ok, thanks for the pad and paste explanation. Nevertheless, as you say in a harsh environment pad is the way to go. In other circumstances I can see paste being the answer, especially with the frequent changing of CPU and/or HSFs and thermal paste technology is ahead of pad technology I guess too.

    So there is a compelling reason to use pads for you.

  14. #14
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    In any comparative test you find thermal paste wins easily, with a difference of anything from a few degrees Celsius (still worth it in my opinion) to tens of degrees.

    A Google search yields the following:

    http://www.hardocp.com/article.html?art=MTc3LDQ=
    http://www.thetechzone.com/reviews/r...nd/page9.shtml
    http://www.heatsink-guide.com/paste.htm
    http://www.overclockers.com/articles03/index06.asp
    http://www.overclockers.com.au/techs...c1/page3.shtml

    Sure thermal pads or tape work "just fine" or "as specified", just not as well as thermal paste.

  15. #15
    Ultimate Member SPEEDO's Avatar
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    Lapping a heatsink is a waste of time too. If you put a mirror finish on a surface it actually has less surface contact then a rougher finish. Why do you think heatsinks are finned and not solid blocks.
    Your confusing air flow with contact surface. You need to rethink your statement.

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