flip chip

[saint]

can someone tell me what the heck is a flip chip i want too buy a processor my Manuel says i need a slot one chip

[Wiz]

flip chips are FC-PGA, or Flip Chip Pin Grid Array. Basically, they are the chips wiht the little pins coming out of them. Slot 1 and slot A look like nintendo cartridges.

[Szech]

You can get a slotket to convert a flip chip (socket 370) to a slot 1.

[jl123]

http://www.ask.com/main/metaanswer.asp?metaEngine=directhit&origin=0&MetaURL=http%3A%2F%2Fwww%2Egeek%2Ecom%2Ftechupdate %2Fjun99%2Fp3sock370%2Ehtm&qCategory=jeeves&metaTopic=UGeek+G eek+News+%2D+Pentium+III+Socket+370&ItemOrdinal=0&logQID=29F320337D36D411BCAD00A0C9AD0A80

This is a pretty good explanation of the FCPGA P3. http://sysopt.earthweb.com/forum/smile.gif

~Joel(jl123)

[tonym]

I took a look at the Intel articles and I think they're being a little obscure in their explanation.

A flip-chip component is a semiconductor die that has solder "bumps" deposited on it's input/output pads (I/O) instead of the aluminum metalization normally used. Conventional packaged die are placed in a package and the bottom of the die is attached to metalization on the bottom of the package with solder or a eutectic alloy. The I/O connections are made from the die to the package with 0.7 to 1 mil diameter aluminum or gold wire bonds. Finally, a metal or ceramic lid is affixed to the package to prevent handling and environmental damage.

A flip-chip device does away with the wire bonds. The die is "flipped" onto it's face and the solder bumps are aligned with metalization etch runs that connect to the package I/O pins, and the solder is reflowed. The bare backside of the die (through which all the heat generated flows) is now readily available in an orientation for maximum heat flow -- straight to a heat sink!

The flip-chip packaged uP tends to be anywhere from 25 to 50% thinner than a conventionally-packaged uP! This opens up opportunities for slimmer portable computers and desktop units that can use a smaller heatsink (the case to ambient thermal resistance is significantly reduced).

BTW, IBM pioneered flip-chip technology with their C4 interconnect system (controlled collapse connection construction, I think), over 10 years ago!

Hope this helps...


Tony

[saint]

thanks you guys for all your help know i think i know what a flip-chip is