Building my first system need advice.

[lukethack]

Hello, I have really gotten into computers and hardware over the last year. I have decided to build my own system. My current systems are 450 mhz and 550 mhz amd cpus. They are both probably fast enough for what I do with the computer but I wanted to build a really nice and fast computer. I

Here is the hardware I chose

amd athlon xp 1600 cpu
Soyo K7V Dragon + kt266a
OCZ Glacier w/Whisper Quiet Fan
ata 100 7200 rpm 40.0 gig Maxtor HD
256MB DDR PC-2100

Hardware I am going to use from my other computer
Voodoo3 3000
16x10x40 CD-RW

I ordered my hardware and it is on the way. I know how to set everthing up because I have replaced a motherboard and other components on my current computers. I don't plan on overclocking I just want it to run smooth. I just have a few questions I would like answered before I start putting everything together.

I ordered a tube of OCZ Quicksilver II. Do I need to use it if I don't overclock the cpu?
If I should use it how do you put it on?
Do I just smear it all over the top of the chip? If so how thick should it be?
The place I purchased the hardware through in some kind of copper shim for free. Should I put the compound on it? What benafit do either the copper shim or the compound have?

If anyone can give me some advice I would sure appreciate it.

Luke

[Jimstep]

That's a nice setup. I'd go with 512Mb of DDR ram and replace the Voodoo card with a G3Ti200. I have a Voodoo3 2000 and love it. But the nVidia graphics for the games I play look a lot better. If you don't play games, then I think the Voodoo's 2d looks better

Use just a pinhead drop of thermal compound and spread it paper thin. The object of the compound is to fill in any gaps or pits that the bottom of the heatsink may have. This insures a consistent contact with the top of the cpu. Make sure you only get the compound on the cpu chip itself, not the bridges and other components on the die cast.

LOL :cool:

[lukethack]

I like to play games but don't have any and rarley get a chance to play them. I am just trying to build a quality system at a cheap price now. I will get a better video card before long. I thought about going with 512 mb of ddr. I have used 256 in my other systems and when I upgraded to 512 it didn't notice a real performance boost. Thanks for the information! I can't wait to get it up and running and see how much faster it is actually going to be. Take it easy!

Luke

[hyborn]

Dont make the same mistake that I did, make sure you get a mobo with good upgrade'ability in the future.

Especially if you want to upgrade Video Cards.

the only thing that mine supports is GF1's, and I am not well impressed !

[Bullet-Man-2]

Originally posted by hyborn
Dont make the same mistake that I did, make sure you get a mobo with good upgrade'ability in the future.

Especially if you want to upgrade Video Cards.

the only thing that mine supports is GF1's, and I am not well impressed !

well that mobo is very upgradable. I mean most current G4's are tested under pc-133 systems on 1Ghz athlons.

So relax, with that system setup you will have a ncie smooth system.

yet I do recommend you buy a bigger and badder video card. A video card made my 450 intel better and smoother compired to a 16mb 300 some dollar Diamond Monster Fusion I bought when it was as new as a G4!

[$1500-P4 gamer]

I didn't see anyone answer the copper shim question though!The copper shim is to prevent cracking the core when putting the HSF on.My duron 1gig was really tight when I put on the HSF.IT is not hard to imagine cracking the thing.Stupid spring clip deseign!So the shim disperses the pressure more evenly over the cpu(actually its the fab material around the die).Also try to keep the HSF unit as close to parallel to the cpu as posible.Don't hold the HSF on a angle as you pop the clips.This is how most crack the core!

Things to note about said shim though.Is it electro-plated?All the good ones are electro-plated as to prevent shorts if the shim shifts(and it does happen!).Secondly make sure that when you place the shim on it rests evenly without hanging on the die or L1&L2 bridges.This is important as I got one for the duron-was made for XP.It had a slightly dif. cut out as to not clear the bridges.That woulda cracked her.Bummer:(

And no DO NOT apply thermal paste to the shim.Especially one with silver content or that is rated to be conductive under pressure,contanimates(dirt),or capacitive(will build and hold electricity,then release:( ).Artic silver ceramic will qualify for this use but why?It will just make a mess.It offers no heat benefits as the die makes the heat and the shim doesnt touch it.
Some even say that by useing a paste on the shim it does the opposite of wanted effect.By conducting the heat better(paste)from the Heatsink to the chip surface and through to the backside of the socket.This is already a heat trap(the back of socket)so its all bad!
No paste on shim.
Hope that helped.:)

[namrak]

To be honest, I personally don't think that the processor chips crack as easily as websites make them out to be. I've never had any problems with them, though I think certain hsf combos can increase the likelihood. Thermaltake's orb line comes to mind. But what the heck, if the copper shim is free, give it a try. It certainly adds a bit insurance, if not in practicality, but in mind as well.

[Bullet-Man-2]

lol... I worked up a sweat trying to attach my HSF.... Its not funny. There are to many stories of ppl cracking ther chips from thar HSF...

oh well. I need to redo my HSF, but I need some good thermal paste first. :rolleyes: